The NSN part number 5961-00-838-1700 manufactured by Dpa Labs Inc, Ogden Air Logistics Center, Boeing Company The, Telcom Semiconductor Inc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts 8746940 01, 8746940 01, 479-0007-001, 341M. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5961-00-838-1700 part of Semiconductor Devic we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
Alternative NSN: 5961-00-838-1700 |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 008381700 |
NCB Code: USA (00) |
Manufacturers: Boeing Company The, Dpa Labs Inc, Ogden Air Logistics Center, Telcom Semiconductor Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
8746940 01 | dpa labs inc | semiconductor devic | Avl | RFQ |
8746940 01 | ogden air logistics center | semiconductor devic | Avl | RFQ |
479-0007-001 | boeing company the | semiconductor devic | Avl | RFQ |
341M | telcom semiconductor inc | semiconductor devic | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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