Part Number List of NSN 5962-00-150-1150, 5962001501150 - Microcircuit Memory
The NSN part number 5962-00-150-1150 manufactured by Texas Instruments Incorporated, Edo Corporation is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts ZA5803, TMS4300JCZA5914, TMS4300JCZA5803, 373729-3. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-00-150-1150 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-00-150-1150 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 001501150 |
| NCB Code: USA (00) |
| Manufacturers: Edo Corporation, Texas Instruments Incorporated |
Part Number's List for NSN 5962-00-150-1150, 5962001501150
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ZA5803 | texas instruments incorporated | microcircuit memory | Avl | RFQ |
| TMS4300JCZA5914 | texas instruments incorporated | microcircuit memory | Avl | RFQ |
| TMS4300JCZA5803 | texas instruments incorporated | microcircuit memory | Avl | RFQ |
| 373729-3 | edo corporation | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962001501150
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.315 INCHES MINIMUM AND 1.415 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 800.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -25.0/+85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 00752-373729 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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