Part Number List of NSN 5962-01-131-5624, 5962011315624 - Microcircuit Memory
The NSN part number 5962-01-131-5624 manufactured by Selex Es Limited, Lansdale Semiconductor Inc, Dla Land And Maritime, Fairchild Semiconductor Ltd is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts SS31811-102, FC3351-1DM-1, DMS 88020B, 33511DMQB. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-131-5624 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-131-5624 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011315624 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime, Fairchild Semiconductor Ltd, Lansdale Semiconductor Inc, Selex Es Limited |
Part Number's List for NSN 5962-01-131-5624, 5962011315624
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| SS31811-102 | selex es limited | microcircuit memory | Avl | RFQ |
| FC3351-1DM-1 | lansdale semiconductor inc | microcircuit memory | Avl | RFQ |
| DMS 88020B | dla land and maritime | microcircuit memory | Avl | RFQ |
| 33511DMQB | fairchild semiconductor ltd | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962011315624
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MINIMUM AND 1.510 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.565 INCHES MINIMUM AND 0.590 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.110 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | B-52G/H WST 36378 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ASYNCHRONOUS AND EXPANDABLE AND W/ENABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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