The NSN part number 5962-01-142-5118 manufactured by Philips Semiconductors Ltd, Intersil Inc, Intel Corporation, Advanced Micro Devices Inc, Hewlett Packard Inc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts N82S181F, HM1-7681-5, D3628, AM27S181DC, 1816-1200. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-142-5118 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
Alternative NSN: 5962-01-142-5118 |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011425118 |
NCB Code: USA (01) |
Manufacturers: Advanced Micro Devices Inc, Hewlett Packard Inc, Intel Corporation, Intersil Inc, Keysight Technologies Inc, Philips Semiconductors Ltd |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
N82S181F | philips semiconductors ltd | microcircuit memory | Avl | RFQ |
HM1-7681-5 | intersil inc | microcircuit memory | Avl | RFQ |
D3628 | intel corporation | microcircuit memory | Avl | RFQ |
AM27S181DC | advanced micro devices inc | microcircuit memory | Avl | RFQ |
1816-1200 | hewlett packard inc | microcircuit memory | Avl | RFQ |
03582-60303 | hewlett packard inc | microcircuit memory | Avl | RFQ |
03582-60303 | keysight technologies inc | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0 TO 75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 160.0 DEG CELSIUS |
AGAV | III END ITEM IDENTIFICATION | SPECTRUM ANALYSER 28480 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMED AND 3-STATE OUTPUT AND HIGH SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CRHL | BIT QUANTITY | 8192 |
CSWJ | WORD QUANTITY | 1024 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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