The NSN part number 5962-01-235-1963 manufactured by Dla Land And Maritime, Intel Corporation, Seeq Technology Inc, Thales Sa, N A I Technologies Inc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts ROM PROM HEAD 148, MD2817A-25B, MD2817A-25, M2817A-250 B, DM2817A250 B. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-235-1963 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
Alternative NSN: 5962-01-235-1963 |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012351963 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime, Honeywell International Inc, Intel Corporation, N A I Technologies Inc, Seeq Technology Inc, Thales Sa |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
ROM PROM HEAD 148 | dla land and maritime | microcircuit memory | Avl | RFQ |
MD2817A-25B | intel corporation | microcircuit memory | Avl | RFQ |
MD2817A-25 | intel corporation | microcircuit memory | Avl | RFQ |
M2817A-250 B | seeq technology inc | microcircuit memory | Avl | RFQ |
DM2817A250 B | seeq technology inc | microcircuit memory | Avl | RFQ |
91594791 | thales sa | microcircuit memory | Avl | RFQ |
887038 | n a i technologies inc | microcircuit memory | Avl | RFQ |
8511462-462 | honeywell international inc | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND ERASABLE AND W/ENABLE AND HIGH PERFORMANCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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