Part Number List of NSN 5962-01-264-5238, 5962012645238 - Microcircuit Memory
The NSN part number 5962-01-264-5238 manufactured by Dla Land And Maritime, Advanced Micro Devices Inc, Mmi Amd, Texas Instruments Incorporated is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts 81036, 8103608SA, 8103608SB, 8103608SX, AMPAL16R8A BSA. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-264-5238 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-264-5238 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012645238 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc, Dla Land And Maritime, Mmi Amd, Texas Instruments Incorporated |
Part Number's List for NSN 5962-01-264-5238, 5962012645238
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 81036 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8103608SA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8103608SB | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8103608SX | dla land and maritime | microcircuit memory | Avl | RFQ |
| AMPAL16R8A BSA | advanced micro devices inc | microcircuit memory | Avl | RFQ |
| PAL16R8AMW-883B | mmi amd | microcircuit memory | Avl | RFQ |
| PAL16R8AMWB | texas instruments incorporated | microcircuit memory | Avl | RFQ |
| ROM PROM HEAD 255 | dla land and maritime | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962012645238
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.092 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM DELAY |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
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