Part Number List of NSN 5962-01-266-3037, 5962012663037 - Microcircuit Memory
The NSN part number 5962-01-266-3037 manufactured by Mmi Amd, Philips Semiconductors Ltd, Intersil Inc, L 3 Communications Electronic, Rockwell Collins Inc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts 53S841, 82S185F, HM1 7685 8, PC200568-0004, PC200568-0004. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-266-3037 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-266-3037 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012663037 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime, Intersil Inc, L 3 Communications Electronic, Mmi Amd, Philips Semiconductors Ltd, Rockwell Collins Inc |
Part Number's List for NSN 5962-01-266-3037, 5962012663037
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 53S841 | mmi amd | microcircuit memory | Avl | RFQ |
| 82S185F | philips semiconductors ltd | microcircuit memory | Avl | RFQ |
| HM1 7685 8 | intersil inc | microcircuit memory | Avl | RFQ |
| PC200568-0004 | l 3 communications electronic | microcircuit memory | Avl | RFQ |
| PC200568-0004 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| PC73618-1 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 007 | dla land and maritime | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962012663037
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.200 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 PRINTED CIRCUIT |
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