Part Number List of NSN 5962-01-291-5011, 5962012915011 - Microcircuit Memory
The NSN part number 5962-01-291-5011 manufactured by Fujitsu Microelectronics Inc, Integrated Device Technology Inc, White Electronic Designs Corp, Dla Land And Maritime, Ge Aviation Systems Llc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts MB84256-15CV-W-SC, IDT71256L55L32B, IDT71256L150L32B, EDI8832C55LB, 5962-8855203YX. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-291-5011 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-291-5011 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012915011 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime, Fujitsu Microelectronics Inc, Ge Aviation Systems Llc, Integrated Device Technology Inc, White Electronic Designs Corp |
Part Number's List for NSN 5962-01-291-5011, 5962012915011
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| MB84256-15CV-W-SC | fujitsu microelectronics inc | microcircuit memory | Avl | RFQ |
| IDT71256L55L32B | integrated device technology inc | microcircuit memory | Avl | RFQ |
| IDT71256L150L32B | integrated device technology inc | microcircuit memory | Avl | RFQ |
| EDI8832C55LB | white electronic designs corp | microcircuit memory | Avl | RFQ |
| 5962-8855203YX | dla land and maritime | microcircuit memory | Avl | RFQ |
| 168999-03 | ge aviation systems llc | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962012915011
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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