Part Number List of NSN 5962-01-299-6398, 5962012996398 - Microcircuit Memory
The NSN part number 5962-01-299-6398 manufactured by Seeq Technology Inc, Raytheon Company, Atmel Corporation, Advanced Micro Devices Inc is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts LM2817A-250 B, G278424-852, AT28C17 25LM 883, AM2817A-25 BUC. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-299-6398 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-299-6398 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012996398 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc, Atmel Corporation, Raytheon Company, Seeq Technology Inc |
Part Number's List for NSN 5962-01-299-6398, 5962012996398
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| LM2817A-250 B | seeq technology inc | microcircuit memory | Avl | RFQ |
| G278424-852 | raytheon company | microcircuit memory | Avl | RFQ |
| AT28C17 25LM 883 | atmel corporation | microcircuit memory | Avl | RFQ |
| AM2817A-25 BUC | advanced micro devices inc | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962012996398
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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