Part Number List of NSN 5962-01-341-2449, 5962013412449 - Microcircuit Memory
The NSN part number 5962-01-341-2449 manufactured by Ge Aviation Systems Llc, Dpac Technologies Corp, Seeq Technology Inc, Xicor Ltd is available in NSN Components’ inventory. Owned and operated by ASAP Semiconductor, we have an inventory of over six billion parts, including NSN Parts 7108912-001, DPE51288S-300B, MM28C010-300MP, XM28C010M. ASAP is dedicated to streamlining the parts procurement process for our customers, with dedicated account managers ready to solve procurement issues that they face. Each NSN 5962-01-341-2449 part of Microcircuit Memory we ship goes through numerous quality checks and inspections, to ensure we sell only the highest-quality parts. Ready to start? Then submit a Request for Quote from this page today.
| Alternative NSN: 5962-01-341-2449 |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013412449 |
| NCB Code: USA (01) |
| Manufacturers: Dpac Technologies Corp, Ge Aviation Systems Llc, Seeq Technology Inc, Xicor Ltd |
Part Number's List for NSN 5962-01-341-2449, 5962013412449
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 7108912-001 | ge aviation systems llc | microcircuit memory | Avl | RFQ |
| DPE51288S-300B | dpac technologies corp | microcircuit memory | Avl | RFQ |
| MM28C010-300MP | seeq technology inc | microcircuit memory | Avl | RFQ |
| XM28C010M | xicor ltd | microcircuit memory | Avl | RFQ |
Product Characteristics of NSN 5962013412449
| MRC | Criteria | Characteristic |
|---|---|---|
| MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
| MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
| MEMORY | CQWX | OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC |
| MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC5 00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| MEMORY | CZEP | CAPITANCE RATING PER CHARACTERISTICERR-060 MAXIMUM AND ERR-060 MAXIMUM |
| MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
| MEMORY | ABKW | OVERALL HEIGHT0 500 INCHES MAXIMUM |
| MEMORY | ADAU | BODY HEIGHT0 285 INCHES MAXIMUM |
| MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
| MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND WENABLE AND BIDIRECTIONAL |
| MEMORY | CRHL | BIT QUANTITY1024000 |
| MEMORY | CSWJ | WORD QUANTITY128000 |
| MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
| MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-500 0 MILLIVOLTS MINIMUM POWER SOURCE AND 7 0 VOLTS MAXIMUM POWER SOURCE |
| MEMORY | CZEQ | TIME RATING PER CHACTERISTIC300 00 NANOSECONDS MAXIMUM ACCESS |
| MEMORY | CZER | MEMORY DEVICE TYPEEEPROM |
| MEMORY | ADAQ | BODY LENGTH1 560 INCHES MINIMUM AND 1 640 INCHES MAXIMUM |
| MEMORY | ADAT | BODY WIDTH0 610 INCHES NOMINAL |
| MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING2 0 WATTS |
| MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
| MEMORY | CQZP | INPUT CIRCUIT PATTERN28 INPUT |
| MEMORY | CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCYMEMORY MODULE ASSEMBLY |
| MEMORY | TTQY | TERMINAL TYPE AND QUANTITY32 PRINTED CIRCUIT |
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